“During 2006 we have reached significant milestones such as finalising product development, starting up a U.S. branch office, almost doubling the number of employees in team, [and] signing up with leading Asian contract manufacturers, said André Eriksen, founder and CEO.
This follow-on investment will enable Asetek to products during 2007. The Broenderslev, Denmark-based company says that with the arrival of native 4, 8 and 16-core CPUs, multi-CPU motherboards, rapidly increasing graphics chip power, increasing end-user demand for smaller form factors/lower acoustic emission, and finally datacenters that are struggling with cooling and density problems, are all factors driving the market for its products.
During 2007 Asetek will seek to develop OEM partnerships. Gregers Kronborg, Chairman of Asetek and General Partner with Northzone Ventures said, “Asetek will make the thermal solution an enabling design parameter to be considered strategically up front rather than a necessary evil fitted at the back end.”
“Efficient chip-cooling can no longer be provided by inexpensive ‘off the shelf’ single components. In the future optimised chip-cooling solutions will be an integral and important part of the system design process.
Asetek's liquid cooling solutions are based on know-how from different disciplines including thermodynamics, acoustics, fluid and air flow dynamics, mechanics, and material science.
Receive the Funding Newswire each Tuesday, our Policy Bulletin each Thursday, and news about bridging Europe’s east-west innovation gap twice a month in The Widening. 
A unique international forum for public research organisations and companies to connect their external engagement with strategic interests around their R&D system.
