New method for wafer packaging of micro electronic devices

Research lead | Development opportunity

While existing polymer-based packaging and intermediate layer bonding techniques offer flexibility and low-cost in package design, their porous nature and limited barrier properties mean they suffer from a lack of good hermeticity.

A new method for wafer level packaging of MEMS (Micro Electro Mechanical Systems), MOEMS (Micro Electro Optical Mechanical System), and other micro-electronics devices using composite materials based on commercially available polymers and established manufacturing processes, has now been developed.

The new bonding approach retains the advantages associated with the conventional polymer/adhesive based wafer bonding method, but offers high hermeticity.

Prototype packages have shown a negligible leak rate below the sensitivity of the Helium-based leak test system. It can also offer novel vertical and through-cover interconnects for MEMS and sensors.

Apart from the high hermeticity of the seals, this represents a low cost encapsulation and joining process for dissimilar surfaces, such as glass/ silicon. It is a low temperature bonding technology with high bond strength.

While being based on commercially proven polymer systems, the method eliminates the need to prepare the wafer surface for bonding.

For more information, visit the project’s page at: http://www.university-technology.com/details/high-hermeticity-polymer-based-micro-cavity-for-wafer-level-mems-device-encapsulation