Heriot-Watt University researchers have developed a method of metallising polymer films such as flexible polyimide using visible light and low cost natural photocatalyst materials.
Photo reduction or photo deposition is known within the electronics & circuit industry using high powered UV light sources, organic catalysts and metal salt complexes containing silver, gold, palladium etc.
This is the first demonstration of such a process using visible light and a "nature inspired" catalyst system. to produce either a conductive film or a seed layer.
A published White paper is available on early work in this area - Google search on "Hhoyd-Gigg Ng, Heriot-Watt".
Key Benefits
Low cost process for creating conductive metallic tracks on Polymer films
Uses visible light - lowers cost vs UV exposure systems
Visible light = less film damage vs UV systems
Low cost, Nature derived Photocatalyst system - "Green benefits"
Seed layer produced is compatible with existing electroless plating solutions (gold/copper etc.)
Applications
Microelectronics - metallisation of flexible films such as Polyimide
Production of circuitry on flex/ flex-rigid substrates
Deposition of "seed layers" for electroless plating
Prototyping of circuit boards, antenna & flex or flex-rigid circuitry
IP Status
GB Patent Application filed to establish priority (Feb 2011).
Know-How & Process knowledge is being held as trade secret. Process has been demonstrated at "bench level" giving good adhesion & conductivity on flexible Polyimide films (sourced from DuPont).
Technology package is available for license or collaborative development in all fields.
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