Researchers at Heriot-Watt University (Edinburgh, Scotland) have developed an adhesive free method for writing conductive tracks on Dielectrics, Ceramic or LCP film/ foils providing a strong bond and leaving no residues that could potentially de-gas or cause failure.
Using a similar set up to the Laser Induced Forward Transfer Process (LIFT Process) where a laser deposits metal from a carrier film to the substrate, the Heriot-Watt process uses "temporary adhesion forces" making it suitable for flexible, small scale production, or prototyping applications.
Applications would include the design & fabrication of antenna, filters & circuits for communication devices.
Key Benefits
- Adhesiveless process - no contamination of substrates
- High Speed, High Definition process - laser scanning using precision XYZ stage
- Application to non-planar surfaces
Applications
- Rapid Prototyping & small scale manufacture
- Suitable for manufacturing Antenna, Filters, Electrodes etc..
- Direct writing of conducting tracks on films & rigid substrates
IP Status
- GB priority patent application filed December 2010.
- Significant supporting know-how in laser system design & process operation.
- "Proof of Principle" demonstrated on lab bench with metal track width <25 micron on dielectric & LCP substrates.
- Technology available for license or collaborative development in all fields.
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