Oxford spin-out raises finance for low-cost 3-D imaging

Funding

Eykona Technologies Ltd, a start-up that is developing a medical imaging device for the wound care market, has announced the closing of initial cornerstone funding with Technikos, a London-based venture capital firm.

Under the agreement Technikos will provide funding for Eykona to accelerate technical and commercial development prior to a full first funding round later this year.

Eykona’s device will allow clinicians to capture detailed three dimensional models of difficult-to-heal wounds, allowing monitoring and assessment, and facilitating remote diagnosis.

The underlying imaging technology was developed in the Engineering Department of Oxford University, and licensed to Eykona by Isis Innovation, the university’s technology transfer company.

The early development of Eykona was supported by H2O Venture Partners in conjunction with the academic co-founders

Mark Kirby, Chairman of Eykona, said “This is a strong endorsement of Eykona’s business prospects and we are delighted to have won the support of Technikos.”